PUR hot melt adhesive for bonding of all kinds of plastic and metal substrate in electronics and micro electronics industry.Mainly for substrates of digital products such as mobile phone, tablet, mobile power pack, laptop, MP3 player, PCB etc.
Advantages:
1. Good high temperature resistance, damp and heat resistance, chemical corrosion resistance
2. High peel strength
3. Good adhesion to variety of substrates.
Application:
1.PUR6302 for bonding of plastic substrate in electronics and micro electronics industry.
2.PUR6301 for bonding of all kinds of substrate in electronics and micro electronics industry .
| Model |
Appearance |
Melting viscosity |
Open time |
Operation temperature |
Application |
| mPa.s |
second |
°C |
| PUR6302 |
white solid |
8000±500/120°C |
360 |
110~130 |
good adhesion to various of plastic materials, suitable for bonding of plastic substrate in electronics and micro electronics industrial. |
| PUR6301 |
white solid |
6000±500/110°C |
90 |
110~130 |
mainly used for bonding of all kinds of substrate in electronics and microelectronics, such as ABS, Makrolon, Fiber Reinforced Plastics, polyester, acrylic, gel coat, epoxy resin, PVC, aluminium alloy, stainless steel, copper, steel alloy etc.
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